C. Scott Brown / Android Authority
TL;DR
- In the Samsung Exynos 2700 processor, the processor will sit alongside DRAM.
- This should provide improved thermal performance, which should lead to better sustained performance and cooler temperatures.
- This follows the Exynos 2600 using a Thermal Path Block to reduce overheating.
The Samsung Exynos 2600 the processor provides power Galaxy S26 and S26 Plus in some markets. However, the company is undoubtedly working on the Exynos 2700 with the aim of using it in the Galaxy S27 series. Now, we seem to have the first details about the new chipset.
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We can confirm that the Samsung Exynos 2700 processor and DRAM will sit side by side on the same substrate. This would be a significant change from previous Exynos chips, which placed the DRAM on top of the processor substrate.
So what is the reason for this change? We understand that this approach should provide improved thermal performance. This is good news, especially in light of leaks that Arm’s next Ultra CPU core could offer maximum clock speeds. almost 5GHz. This new generation CPU core is also expected to be used in the Exynos 2700.
This news comes after Samsung added a so-called Thermal Path Block (HPB) to the Exynos 2600. The HPB is effectively a heat sink, and it used to sit next to the DRAM but on top of the chipset (see image above). So we’re guessing that HPB’s Exynos 2700 may now cover both DRAM and the processor itself due to its new side-by-side approach.
Either way, we’re glad to see Samsung taking these steps to improve thermal performance. If the HPB and side-by-side approach pays off, we could see excellent sustained performance and low device temperatures. This would be good news for heavy duty games or demanding workloads APV take a video.
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