Some Galaxy S27 models may run hotter thanks to this chip option

Some of them Galaxy S27 and S27 Plus models are expected to be equipped with Samsung’s own models Exynos 2700 processor. We’ve already heard the first rumors about this chipset, but a new story suggests that the chip may undergo some significant changes.

Time-Journal reports that the Exynos 2700 chip may eliminate Fan-Out Wafer-Level Packaging (FOWLP). Samsung is probably considering abandoning this advanced manufacturing process because it is a costly process and can also affect yield rates.

This can be a worrying change as FOWLP provides improved thermal performance. This packaging process was first used in the Exynos 2400, and at the time Samsung claimed that it provided “a 23% increase in heat resistance when running on a single core and an 8% improvement for multi-core”.

“I heard that while applying WLP to the flagship Exynos chips was effective in terms of performance and thermal management, it didn’t bring much profit because the packaging itself became too complicated and the yield risk was high,” an industry source told the outlet. “If the volume was large, profitability could be covered to some extent, but as it currently applies to only a portion of the MX business unit’s own models, the cost burden will definitely be heavy.”

It’s not all doom and gloom, though. The Exynos 2600 appears in some Galaxy S26 and S26 Plus variants debuted a heat path block (HPB) that acts as a heat sink to reduce overheating. Additionally, the Exynos 2700 is expected to place the DRAM next to the processor rather than on the chip. This side-by-side approach should allow the HPB to cover both the memory and the processor, improving cooling in the process. But will these changes be enough to compensate for the lack of an advanced packaging process? I guess we’ll have to wait until the Exynos 2700-powered phones land next year.